描述 |
IC tdm switch 2K-CH enh 256pbga |
IC tdm switch 2K-CH enh 256lqfp |
IC tdm switch 2K-CH enh 256pbga |
Digital Time Switch, CMOS, PQFP256, 28 X 28 MM, 1.40 MM HEIGHT, MS-026BJC, LQFP-256 |
是否Rohs认证 |
不符合 |
符合 |
符合 |
不符合 |
厂商名称 |
Microsemi |
Microsemi |
Microsemi |
Microsemi |
零件包装代码 |
BGA |
QFP |
BGA |
QFP |
包装说明 |
17 X 17 MM, 1.61 MM HEIGHT, PLASTIC, MS-034, BGA-256 |
LFQFP, QFP256,1.2SQ,16 |
BGA, BGA256,16X16,40 |
28 X 28 MM, 1.40 MM HEIGHT, MS-026BJC, LQFP-256 |
针数 |
256 |
256 |
256 |
256 |
Reach Compliance Code |
unknow |
compli |
compli |
unknown |
JESD-30 代码 |
S-PBGA-B256 |
S-PQFP-G256 |
S-PBGA-B256 |
S-PQFP-G256 |
JESD-609代码 |
e0 |
e3 |
e1 |
e0 |
长度 |
17 mm |
28 mm |
17 mm |
28 mm |
功能数量 |
1 |
1 |
1 |
1 |
端子数量 |
256 |
256 |
256 |
256 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
BGA |
LFQFP |
BGA |
LFQFP |
封装等效代码 |
BGA256,16X16,40 |
QFP256,1.2SQ,16 |
BGA256,16X16,40 |
QFP256,1.2SQ,16 |
封装形状 |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
封装形式 |
GRID ARRAY |
FLATPACK, LOW PROFILE, FINE PITCH |
GRID ARRAY |
FLATPACK, LOW PROFILE, FINE PITCH |
电源 |
1.8,3.3 V |
1.8,3.3 V |
1.8,3.3 V |
1.8,3.3 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
1.8 mm |
1.6 mm |
1.8 mm |
1.6 mm |
标称供电电压 |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
表面贴装 |
YES |
YES |
YES |
YES |
电信集成电路类型 |
DIGITAL TIME SWITCH |
DIGITAL TIME SWITCH |
DIGITAL TIME SWITCH |
DIGITAL TIME SWITCH |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
TIN LEAD |
MATTE TIN |
TIN SILVER COPPER |
TIN LEAD |
端子形式 |
BALL |
GULL WING |
BALL |
GULL WING |
端子节距 |
1 mm |
0.4 mm |
1 mm |
0.4 mm |
端子位置 |
BOTTOM |
QUAD |
BOTTOM |
QUAD |
宽度 |
17 mm |
28 mm |
17 mm |
28 mm |